XCVC1702-1MLINSVG1369 System On Chip (SoC)_YUANHENG TRADING HK_storage chips_PCBs_integrated circuits_microcontrollers_resistors_capacitors_potentiometers_transformers

Part number：

XCVC1702-1MLINSVG1369

Product classification：

System On Chip (SoC)

Manufacturer：

Xilinx (AMD)

Description：

IC VERSAL AI-CORE FPGA 1369BGA

Encapsulation：

Packing：

Tray

Quantity：

RoHS status：

YES

TYPE	DESCRIPTION
Mfr	Xilinx (AMD)
Series	Versal™ AI Core
Package	Tray
Product Status	ACTIVE
Package / Case	1369-BFBGA, FCBGA
Speed	600MHz, 1.3GHz
RAM Size	256KB
Number of I/O	500
Operating Temperature	-40°C ~ 110°C (TJ)
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes	Versal™ AI Core FPGA, 1M Logic Cells
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DDR, DMA, PCIe
Supplier Device Package	1369-FCBGA (35x35)
Architecture	MPU, FPGA

TYPE

DESCRIPTION

Mfr

Xilinx (AMD)

Series

Versal™ AI Core

Package

Tray

Product Status

ACTIVE

Package / Case

1369-BFBGA, FCBGA

Speed

600MHz, 1.3GHz

RAM Size

256KB

Number of I/O

500

Operating Temperature

-40°C ~ 110°C (TJ)

Core Processor

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Primary Attributes

Versal™ AI Core FPGA, 1M Logic Cells

Connectivity

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Peripherals

DDR, DMA, PCIe

Supplier Device Package

1369-FCBGA (35x35)

Architecture

MPU, FPGA